3D-multi layer prints of Mechatronic Integrated Devices

These days development of additive manufacturing makes it possible to integrate functional elements in 3D components. In collaboration with industrial partners, ITA researches the generation of 3D multilayer devices (3D-MLD) through the laser-induced sintering of conductive layers. Thereby it is possible to create electrical-mechanical hybrid components that open up a diverse range of products.

The technical approach is based on the alternating coating of conductive and insulating layers on a 3D circuit carrier surface. The conductive structures are created by local laser sintering of copper nanoparticle ink. Vertical Interconnect Accesses (VIA) are created by laser ablation of an insulator coating. Laser processing enables the flexible design of fully additively manufactured devices with highly integrated electrical circuits, including micro-VIA and fine-pitch contacts for area array chip packages. Laser processing is executed on industrial production equipment so that the technology is compatible with existing production lines.

The entire process chain is investigated for the achievable properties of copper and insulation layers, the laser process's parameterization, the VIA's reliability, and the validation of the final assembly and soldering processes. Small and medium-sized companies are particularly enabled to manufacture electronic components cost-effectively and with high variability. That enables extensive transfer measures into the economy. The project is funded by the German Federal Ministry of Economics and Energy (BMWi) for funding the project "3D-MLD" (21780 N/1) based on a resolution of the German Bundestag