Production of Optoelectronic Systems

Students have gained knowledge about product manufacturing techniques of semiconductor

components and Microsystems. The focus is on the back-end-process, the production and cutting of

wafers. Techniques like the machining of wafers, bonding (die-, wire-, flip-chip-), Burn-In and packaging of components with special consideration of optoelectronical components will be taught.

Furthermore, application-specific assembly techniques as well as methods for integrating electronical and microtechnological systems will be dealt with.